Film Thermoform R+D

Thin Films
(down to 0.0015” thick)
Flexible Films
(EVA, LLDPE and more)
Multi-layer Barrier Films
(with EVOH, PVDC, PA and more)
Engineering Films
(Ultem™, PEEK™, Polycarbonate, ePTFE and more)
 
Tek Pak develops thermoforming solutions for high-value functional packaging and components using technically challenging films. In most cases we begin the work with our custom-built bench-scale thermoformer using a one- or two-cavity tool. Once the critical thermoforming parameters have been established we then evaluate scale-up options and any post forming operations, such as sealing and trimming, to go the next level.
 

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Thermoform R+D Contact: Scott Carter, Ph.D.